The functionality covers the whole range from - mechanical (i.e. switches, actors, guidances) to
- electronical (thermo-, or magnetoresistive bridges) and even
- optical (waveguides, mirrors) applications.
Therefore we are also able to do complete wafer-processes for complex customer specific MST chips, usually consisting of several functional elements. | The wafer technology comprises | - PVD (e-beam, sputtering)
standard process materials:
Ag, Au, Al, BiSb, Cr, CrSi, Cu, Fe, Ni, NiCr, NiFe, Pd, Pt, SiO2, SiON, Ta, TaN, Ti, TiW
others on request - PECVD:
SiNx, SiOx - lithography (b > 1µ)
- dry etching (IBE, RIBE, RIE)
- wet etching
| | Metallisation | - mirrors
- optical filters
- heaters
- electrodes
- protection coatings
| | SiON-Microstructures | - membranes / thermic isolation
- actors
- guidances
- switches
- holder for transition-electron-microscopy
- V-grooves for optical components
- wavegudes
- cavities for Biomems
- gas sensors
| | Inspection and final testing | - 100 % optical inspection eliminates:
- surface failures
- defects in structure geometry
- passivation defects
- small residues of metal on the surface
- 100 % electrical inspection
- electrical test of special component features through the use of intelligent test chips
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MEAS Deutschland GmbH offers its MST technology process for building functional elements or blocks on wafers up to 6" size as foundry service. The elements may consist of silicon / siliconoxinitride and metallic microstructures.
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